PowerBeam is embarking on an entirely new industry that requires experienced and multi-disciplined individuals.  A breadth of knowledge needed to succeed in this field is required.  As such, applicants should have an understanding of the requirements involve with early stage technology companies.   

Additionally, applicants should be comfortable in a start-up environment.  Our culture is to “work hard but play even harder.”  Of course, the compensation and benefits for your sweat, time and efforts are fairly rewarded.   

If you are interested a career at PowerBeam, please contact us.  

Current Open Positions are:

Laser diode design engineer

• 3+ years experience designing/optimizing Laser diodes (VCSELs/edge-emitting).
• Experience in identifying, selecting and specifying the semiconductor material for fabrication.
• Knowledge of optical resonator cavity designs and selection of materials.
• Knowledge of threshold current versus maximum power trade-offs and corresponding optimizations.
• Ability to understand, specify and design thermally, optically and mechanically optimal packaging for a Laser diode chip.
• Understanding of Photo-detector designs is a plus

  Photo-detector diode design engineer  

• 3+ years experience in designing/optimizing photo-detector diodes
• Experience in identifying, selecting and specifying the semiconductor material for fabrication.
• Knowledge of contact placement, shape of the contacts and their arrangement for minimizing reflections.
• Understanding of the Front surface field and Back surface field and carrier trapping methods to maximize delivered current.
• Understanding of the depth of the junction for most optimal photon collection mechanism, minimization of resistance and fine-tuning the junction design for thermal stability.
• Ability to understand newer technologies and re-think differently from the current solar power photo-detectors.
• Understanding of the integration of photo-detector materials into other material is a plus.

 Thermal design and analysis engineer

• 3+ years experience designing high performance low volume, low weight and low power-consuming heat sink solutions
• Experience with heat-sink designs for extremely high spatial density heat load from electronic components
• Experience with thermally conductive adhesives and other materials to bond and mount heat-sinks to the thermal load
• Extremely good understanding of custom designs of tube-axial and in-line DC fans
• Ability to design heat-sink solution to conform with product shapes and sizes.
• Understanding of designing “cool” mechanical exteriors for electronic components is a plus